DTCO

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers. In this event, TSMC discussed its increasing use of Extreme Ultra Violet (EUV) lithography for manufacturing, enabling it to scale down to its 3nm process node, well beyond that of its competitors. TSMC also addressed the current issues surrounding demand for semiconductors, along with announcing that it is building new facilities for advanced packaging production. Joining CEO Dr. CC Wei as part of the keynote presentation was AMD’s CEO Dr. Lisa Su, Qualcomm’s President (and soon to be CEO) Cristiano Amon, and Ambiq’s Founder and CTO Scott Hanson. As part of the proceedings, TSMC offered AnandTech...

Early TSMC 5nm Test Chip Yields 80%, HVM Coming in H1 2020

Today at the IEEE IEDM Conference, TSMC is presenting a paper giving an overview of the initial results it has achieved on its 5nm process. This process is going...

62 by Dr. Ian Cutress on 12/11/2019

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