RDIMM

The path to high-capacity RDIMMs for servers has primarily been through 3D stacking (3DS) of DRAM dies using Through-Silicon Vias (TSVs). However, this has presented significant challenges in packaging (driving up the cost), and has also not been efficient in terms of energy consumption. The demand for large memory capacity RDIMMs is being primarily driven by the sudden emergence of large-language models (LLMs) for generative AI and increasing CPU core counts. Both of these require significant amount of DRAM to keep pace with performance requirements. Keeping these in mind, Micron is introducing 128 GB DDR5 RDIMMs capable of operating at up to 8000 MT/s today, with mass-production slated for 2024. Micron has recently started fabricating 32 Gb monolithic DDR5 dies using its proven and mature...