Memory

SMART Modular has unveiled a new lineup of 32 GB Mini-DIMMs for extreme environments, such as industrial or telecommunication applications. The new high-density modules come in ULP (Ultra Low Profile) as well as VLP (Very Low Profile) heights and are rated for speeds up to DDR4-3200. SMART’s DDR4-3200 32 GB Mini-DIMMs are based on 16 Gb memory chips (from an unknown supplier) and utilize a custom-designed PCB with conformal coating and anti-sulfur resistors, which is designed to protect against toxic environments as well as vibration. Depending on the target application, SMART provides the high-density 32 GB Mini-DIMMs with unbuffered or registered ECC options. The manufacturer offers its industrial 32 GB Mini-DIMMs in ULP height (17.78 mm) and VLP height (18.75 mm). Mini-DIMMs are JEDEC-standard modules with...

G.Skill Launches 256 GB DDR4-3600 CL16 Memory Kit

The arrival of 32 GB unbuffered DIMMs has not only allowed mainstream systems to reach 128 GB of memory, but it's also allowed high-end desktops based on AMD Ryzen...

8 by Anton Shilov on 2/12/2020

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...

92 by Anton Shilov on 2/11/2020

GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit

GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...

22 by Anton Shilov on 2/6/2020

Micron Shipping LPDDR5 DRAM

Micron has announced their first LPDDR5 DRAM is in mass production and now shipping to customers. The new RAM is significantly faster and more power efficient than LPDDR4x. One...

32 by Billy Tallis on 2/6/2020

JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production

After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...

24 by Ryan Smith on 2/3/2020

SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020

Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...

7 by Anton Shilov on 2/3/2020

Crucial’s 32 GB UDIMMs and SODIMMs Available: DDR4-2666 & DDR4-3200

In the summer of 2019, Crucial was among the first brands to demonstrate 32 GB unbuffered memory modules, which were based on Micron’s 16 Gb DDR4 chips. Now after...

12 by Anton Shilov on 1/29/2020

The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive

The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...

56 by Gavin Bonshor on 1/27/2020

Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM

Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...

39 by Anton Shilov on 1/13/2020

CES 2020: Kingston’s HyperX Adds 32 GB UDIMMs & New Fury Speed Bins to Lineup

Kingston’s HyperX division introduced a stack of new memory modules at CES 2020. Firstly, the company added 32 GB unbuffered DIMMs and SO-DIMMs to its Fury and Impact families...

11 by Anton Shilov on 1/10/2020

DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1

Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about...

4 by Anton Shilov on 1/9/2020

Fire At Kioxia & Western Digital NAND Fab - Impact on Supply to be Minimal

Kioxia has reportedly informed its customers that a production tool at one of its fabs caught fire early on Tuesday. The fire was promptly extinguished and no casualties were...

3 by Anton Shilov on 1/8/2020

CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners

Micron announced at CES that it had started sampling of its DDR5 Registered DIMMs with select partners. The very fact that Micron started sampling of DDR5 modules indicates that...

6 by Anton Shilov on 1/7/2020

Samsung’s Fab in Hwaseong Suffers Power Outage

Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...

48 by Anton Shilov on 1/2/2020

Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future

One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...

24 by Dr. Ian Cutress on 12/30/2019

Micron Obtains License to Sell DRAM & NAND to Huawei

The inclusion of Huawei into the U.S. Department of Commerce’s Entity List and consequent restrictions to work with the Chinese giant clearly made it much harder for the U.S.-based...

12 by Anton Shilov on 12/19/2019

ADATA Reveals XPG Hunter SO-DIMMs: Up to DDR4-3000, Up to 32 GB

ADATA has introduced its new family of SO-DIMMs for laptops and small form-factor desktops. The XPG Hunter DDR4 SO-DIMMs offer data transfer rates of up to 3000 MT/s and...

6 by Anton Shilov on 12/17/2019

Samsung to Expand 3D NAND Fab in China

Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...

5 by Anton Shilov on 12/17/2019

Team Group’s T-Force Xtreem ARGB Memory: Up to DDR4-4800, ‘Mirror Design’

With even "extreme" clockspeed DDR4 modules bordering on being commodity hardware these days, DRAM module manufacturers are increasingly using design as one of the primary ways to attract attention...

0 by Anton Shilov on 12/9/2019

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