N2
TSMC has entered into a preliminary agreement with the U.S. Department of Commerce, securing up to $6.6 billion in direct funding and access to up to $5 billion in loans under the CHIPS and Science Act. With this latest round of support from the U.S. government, TSMC in turn will be adding a third fab to their Arizona project, with its investment in the region soaring to more than $65 billion. This move not only signifies the largest foreign direct investment in Arizona but also marks one of the biggest support packages that the U.S. government plans to make under the CHIPS Act, second only to Intel's $8.5 billion award last month. TSMC is currently equipping its Fab 21 phase 1 and expects that it...
TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval
When Taiwan Semiconductor Manufacturing Co. (TSMC) is prepping to roll out an all-new process technology, it usually builds a new fab to meet demand of its alpha customers and...
38 by Anton Shilov on 1/19/2024
TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC's roadshow was dedicated to the next generation of...
20 by Anton Shilov on 10/12/2023
TSMC Shares More Info on 2nm: New MIM Capacitor and Backside PDN Detailed
TSMC has revealed some additional details about its upcoming N2 and N2P process technology at its European Technology Symposium 2023. Both production nodes are being developed with high-performance computing...
15 by Anton Shilov on 5/31/2023
TSMC Outlines 2nm Plans: N2P Brings Backside Power Delivery in 2026, N2X Added To Roadmap
At its 2023 North American Technology Symposium today, TSMC has disclosed additional details about its plans for its forthcoming N2 2nm-class production nodes in 2025 – 2026 and beyond...
38 by Anton Shilov on 4/26/2023
TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later
When TSMC initially introduced its N2 (2 nm class) process technology earlier this month, the company outlined how the new node would be built on the back of two...
16 by Anton Shilov on 6/29/2022
TSMC Unveils N2 Process Node: Nanosheet-based GAAFETs Bring Significant Benefits In 2025
At its 2022 Technology Symposium, TSMC formally unveiled its N2 (2 nm class) fabrication technology, which is slated to go into production some time in 2025 and will be...
24 by Anton Shilov on 6/16/2022
TSMC Roadmap Update: N3E in 2024, N2 in 2026, Major Changes Incoming
Taiwan Semiconductor Manufacturing Co. has solid plans for the next few years, but the foundry's manufacturing technology design cycles are getting longer. As a result, to address all of...
21 by Anton Shilov on 4/22/2022
TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025
TSMC has introduced a brand-new manufacturing technology roughly every two years over the past decade. Yet as the complexity of developing new fabrication processes is compounding, it is getting...
32 by Anton Shilov on 10/18/2021
TSMC to Spend $100B on Fabs and R&D Over Next Three Years: 2nm, Arizona Fab & More
TSMC this week has announced plans to spend $100 billion on new production facilities as well as R&D over the next three years. The world's largest contract maker of...
45 by Anton Shilov on 4/2/2021
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