One of the interesting disclosures here at the IEEE International Electron Devices Meeting (IEDM) has been around new and upcoming process node technologies. Almost every session so far this week has covered 7nm, 5nm, and 3nm processes (as the industry calls them). What we didn’t expect to see disclosed was an extended roadmap of Intel’s upcoming manufacturing processes.
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...12 by Dr. Ian Cutress on 8/20/2019