For the past eighteen months, Intel has paraded its new ‘Lakefield’ processor design around the press and the public as a paragon of new processor innovation. Inside, Intel pairs one of its fast peak performance cores with four of its lower power efficient cores, and uses novel technology in order to build the processor in the smallest footprint it can. The new Lakefield design is a sign that Intel is looking into new processor paradigms, such as hybrid processors with different types of cores, but also different stacking and packaging technologies to help drive the next wave of computing. With this article, we will tell you all you need to know about Lakefield.
Over the past 12 months, Intel has slowly started to disclose information about its first hybrid x86 platform, Lakefield. This new processor combines one ‘big’ CPU core with four...79 by Dr. Ian Cutress on 6/10/2020
Continuing Intel’s run of Mobile World Congress-released announcements this morning, the chip maker is also announcing an interesting product in the form of a mobile-related Atom. Dubbed the Atom...13 by Ryan Smith on 2/24/2020
While Intel has been discussing a lot about its mainstream Core microarchitecture, it can become easy to forget that its lower power Atom designs are still prevalent in many...101 by Dr. Ian Cutress on 10/24/2019
Intel has already disclosed that it will have a next generation Atom core, code named Tremont, which is to appear in products such as the Foveros-based hybrid Lakefield, as...67 by Dr. Ian Cutress on 7/15/2019
At Intel’s Architecture Day, the company showed off a new stacking technology called ‘Foveros’, which is designed to allows the company to make smaller chips. The idea behind Foveros...10 by Ian Cutress on 1/7/2019
Intel has recently updated its developer documentation for instruction set extensions, and in the process has disclosed information on both new instructions for and the codename of its next-generation...56 by Anton Shilov on 4/23/2018